RF 18.0GHz to 24.0GHz Microstrip Isolator

• Customization: Available
• Insertion Loss(dB)Max: 0.6
• Isolation(dB)Min: 18.0
• Model NO.: HMITA180T240G
• Specification: 4.5*5.5(mm)
• Production Capacity: 10000 Pieces/Month

Product Description

Product description:



2.7 GHz to 32.0 GHz Microstrip Circulators

Number	Wave band	Model	Frequency(GHz)	BW Max	Insertion loss(dB) Max	Isolation(dB)Max	VSWR Max	Direction	Size(mm)	Operating temperature(ºC)
1	S	HMITA27T35G	2.7~3.5	FULL	0.6	20	1.3	clockwise	14*16	-55~+85ºC
2		HMITB27T35G	2.7~3.5	FULL	0.6	20	1.3	Counter Clockwise	14*16	-55~+85ºC
3		HMITA30T40G	3~4	FULL	0.5	18	1.3	clockwise	14*16	-55~+85ºC
4		HMITB30T40G	3~4	FULL	0.5	18	1.3	Counter Clockwise	14*16	-55~+85ºC
5		HMITA31T39G	3.1~3.9	FULL	0.6	18	1.3	clockwise	12*12	-55~+85ºC
6		HMITB31T39G	3.1~3.9	FULL	0.6	18	1.3	Counter Clockwise	12*12	-55~+85ºC
7	S-C	HMITA34T45G	3.4~4.5	FULL	0.6	18	1.3	clockwise	12*12	-55~+85ºC
8		HMITB34T45G	3.4~4.5	FULL	0.6	18	1.3	Counter Clockwise	12*12	-55~+85ºC
9		HMITA35T55G	3.5~5.5	FULL	0.6	16	1.3	clockwise	14*16	-55~+85ºC
10		HMITB35T55G	3.5~5.5	FULL	0.6	16	1.3	Counter Clockwise	14*16	-55~+85ºC
11	C	HMITA40T50G	4~5	FULL	0.5	20	1.25	clockwise	12*12	-55~+85ºC
12		HMITB40T50G	4~5	FULL	0.5	20	1.25	Counter Clockwise	12*12	-55~+85ºC
13		HMITA45T55G	4.5~5.5	FULL	0.5	20	1.25	clockwise	12*12	-55~+85ºC
14		HMITB45T55G	4.5~5.5	FULL	0.5	20	1.25	Counter Clockwise	12*12	-55~+85ºC
15		HMITA50T60G	5~6	FULL	0.5	20	1.25	clockwise	10*10	-55~+85ºC
16		HMITB50T60G	5~6	FULL	0.5	20	1.25	Counter Clockwise	10*10	-55~+85ºC
17		HMITA55T65G	5.5~6.5	FULL	0.5	20	1.25	clockwise	10*10	-55~+85ºC
18		HMITB55T65G	5.5~6.5	FULL	0.5	20	1.25	Counter Clockwise	10*10	-55~+85ºC
19		HMITA65T75G	6.5~7.5	FULL	0.5	20	1.25	clockwise	10*10	-55~+85ºC
20		HMITB65T75G	6.5~7.5	FULL	0.5	20	1.25	Counter Clockwise	10*10	-55~+85ºC
21		HMITA50T80G	5~8	FULL	0.6	18	1.3	clockwise	10*10	-55~+85ºC
22		HMITB50T80G	5~8	FULL	0.6	18	1.3	Counter Clockwise	10*10	-55~+85ºC
23		HMITA60T80G	6~8	FULL	0.6	18	1.3	clockwise	10*10	-55~+85ºC
24		HMITB60T80G	6~8	FULL	0.6	18	1.3	Counter Clockwise	10*10	-55~+85ºC
25	C-X	HMITA70T95G	7.0~9.5	FULL	0.6	17	1.35	clockwise	7*8	-55~+85ºC
26		HMITB70T95G	7.0~9.5	FULL	0.6	17	1.35	Counter Clockwise	7*8	-55~+85ºC
27		HMITA75T95G	7.5~9.5	FULL	0.6	20	1.25	clockwise	7*8	-55~+85ºC
28		HMITB75T95G	7.5~9.5	FULL	0.6	20	1.25	Counter Clockwise	7*8	-55~+85ºC
29	C-Ku	HMIYA70T130G	7~13	FULL	0.7	16	1.35	clockwise	6*7.5	-55~+85ºC
30		HMIYB70T130G	7~13	FULL	0.7	16	1.35	Counter Clockwise	6*7.5	-55~+85ºC
31	X	HMITA80T100G	8~10	FULL	0.5	20	1.25	clockwise	6*7	-55~+85ºC
32		HMITB80T100G	8~10	FULL	0.5	20	1.25	Counter Clockwise	6*7	-55~+85ºC
33		HMITA85T105G	8.5~10.5	FULL	0.5	20	1.25	clockwise	6*7	-55~+85ºC
34		HMITB85T105G	8.5~10.5	FULL	0.5	20	1.25	Counter Clockwise	6*7	-55~+85ºC
35		HMITA80T120G	8~12	FULL	0.5	18	1.3	clockwise	6.5*7.5	-55~+85ºC
36		HMITB80T120G	8~12	FULL	0.5	18	1.3	Counter Clockwise	6.5*7.5	-55~+85ºC
37		HMITA80T120G	8~12	FULL	0.6	18	1.35	clockwise	6*7	-55~+85ºC
38		HMITB80T120G	8~12	FULL	0.6	18	1.35	Counter Clockwise	6*7	-55~+85ºC
39		HMITA90T110G	9~11	FULL	0.5	20	1.25	clockwise	6*7	-55~+85ºC
40		HMITB90T110G	9~11	FULL	0.5	20	1.25	Counter Clockwise	6*7	-55~+85ºC
41		HMITA100T120G	10~12	FULL	0.5	20	1.25	clockwise	6*7	-55~+85ºC
42		HMITB100T120G	10~12	FULL	0.5	20	1.25	Counter Clockwise	6*7	-55~+85ºC
43	X-Ku	HMITA110T130G	11~13	FULL	0.5	20	1.25	clockwise	6*7	-55~+85ºC
44		HMITB110T130G	11~13	FULL	0.5	20	1.25	Counter Clockwise	6*7	-55~+85ºC
45	Ku	HMITA120T150G	12~15	FULL	0.5	18	1.3	clockwise	6*7	-55~+85ºC
46		HMITB120T150G	12~15	FULL	0.5	18	1.3	Counter Clockwise	6*7	-55~+85ºC
47		HMITA120T180G	12~18	FULL	0.7	16	1.4	clockwise	6*7	-55~+85ºC
48		HMITB120T180G	12~18	FULL	0.7	16	1.4	Counter Clockwise	6*7	-55~+85ºC
49		HMITA140T180G	14~18	FULL	0.5	20	1.25	clockwise	5*6	-55~+85ºC
50		HMITB140T180G	14~18	FULL	0.5	20	1.25	Counter Clockwise	5*6	-55~+85ºC
51		HMITA150T170G	15~17	FULL	0.45	21.5	1.17	clockwise	3.5*4.5	-55~+85ºC
52		HMITB150T170G	15~17	FULL	0.45	21.5	1.17	Counter Clockwise	3.5*4.5	-55~+85ºC
53	Ku-K	HMITA150T200G	15~20	FULL	0.6	18	1.3	clockwise	5*6	-55~+85ºC
54		HMITB150T200G	15~20	FULL	0.6	18	1.3	Counter Clockwise	5*6	-55~+85ºC
55	K	HMITA180T220G	18~22	FULL	0.5	20	1.25	clockwise	4.5*5.5	-55~+85ºC
56		HMITB180T220G	18~22	FULL	0.5	20	1.25	Counter Clockwise	4.5*5.5	-55~+85ºC
57		HMITA180T240G	18~24	FULL	0.6	18	1.3	clockwise	4.5*5.5	-55~+85ºC
58		HMITB180T240G	18~24	FULL	0.6	18	1.3	Counter Clockwise	4.5*5.5	-55~+85ºC
59	K-Ka	HMITA240T280G	24~28	FULL	0.7	18	1.3	clockwise	4.5*5.5	-55~+85ºC
60		HMITB240T280G	24~28	FULL	0.7	18	1.3	Counter Clockwise	4.5*5.5	-55~+85ºC
61	Ka	HMITA280T320G	28~32	FULL	0.8	17	1.35	clockwise	3.5*4.5	-55~+85ºC
62		HMITB280T320G	28~32	FULL	0.8	17	1.35	Counter Clockwise	3.5*4.5	-55~+85ºC

 

 
Custom Design:
 

Applications:

 

Wireless Communication Base Station
 

Radar System
 

RF Circuit
 

Microwave Radio Systems
 

T/R Module
 

GPS
 

Cavity Filter
 

Public Address System Radio Transmitter
 

Satellite TV



 

Mounting instructions for microstrip Components:

Storage : Components must be kept in a dry and protected environment. (Such as nitrogen gas cabinet or drying cabinet).
Normal operation : In the purification environment, it is necessary to wear dust-free finger covers and use plastic head or bamboo tweezers to avoid colliding with the substrate and scratching the microstrip line during operation.
Cleaning treatment : The components can be cleaned in absolute ethanol, and can also be gently wiped with absolute ethanol cotton balls. It is strictly forbidden to clean in an ultrasonic cleaner.
Installation :
* Soldering process. The components installation is recommended to use the soldering material which melting temp. is ≤183 ºC. Such as solder paste Sn63Pb37 or solder sheet. Use the heating table for soldering. After the solder fully melted at 200ºC and remove the components. The continuous time should< 30 seconds.
* Adhesion process: Use less and smooth conducting resin. It is finished when conductive adhesive can be seen around the component after it is placed in the installation position and pressed tightly. The curing temperature is less than 140ºC for baking.
Port connection :

• Bonding method: Gold bonding wire is recommended to use 25μm, thermosonic bonding temperature is 100 ~ 150ºC, spherical bonding wedge pressure is 30 ~ 55gf, shaped bonding wedge pressure is 15 ~ 25gf.
• Tin soldering method: Place the box installed microstrip components on the 120 ºC heating box to preheat. It is recommended to use the soldering material which melting temp. is ≤183 ºC, preload the gold-plated copper foil connection line into a certain arc and lap coat the microstrip line with flux. Use the pointed soldering iron to solder the connection line in turn, soldering iron setting temperature is 210 ºC ~ 230 ºC,soldering time less than 2 seconds per time, solder as little as possible and keep solder joints smooth and round. Generally, we don't recommend soldering for lead wires.

Assembly diagram :
(1): The installation hole (slot) size of the components shall be controlled as follows: length x width x height.

(2): Unilateral assembly gap of components should be <0.05mm.